COMPOSITION FOR PLATING COPPER AND METHOD OF FORMING CONDUCTORS INCLUDING COPPER USING THE SAME

Embodiments of the present invention provide a composition for copper plating and a method for manufacturing a copper-containing conductor using the same. The composition for copper plating includes a copper salt, an acidic compound or a salt thereof, a chlorine ion source, and a leveling agent repr...

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Bibliographische Detailangaben
Hauptverfasser:	LEE SUCK JUN, LEE DONG RYUL, KWON O BYOUNG, HEO JI EUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	Embodiments of the present invention provide a composition for copper plating and a method for manufacturing a copper-containing conductor using the same. The composition for copper plating includes a copper salt, an acidic compound or a salt thereof, a chlorine ion source, and a leveling agent represented by the specific chemical formula 1. A copper plating film having high surface flatness and thickness uniformity can be formed through an electrolytic plating process using the copper plating composition. 본 발명의 실시예들은 구리 도금용 조성물, 이를 이용한 구리 함유 도전체의 제조 방법을 제공한다. 구리 도금용 조성물은 구리염, 산성 화합물 또는 이의 염, 염소 이온 소스 및 특정 화학식 1로 표시되는 레벨링제를 포함한다. 상기 구리 도금용 조성물을 이용한 전해 도금 공정을 통해 높은 표면 평탄도 및 두께 균일성을 갖는 구리 도금막이 형성될 수 있다.