DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES

A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity in which the substrate can be positioned for molding, wherein the molding cavity has a first section covering a molding portion on a first side of the substrate and a second secti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUAH TENG HOCK, ANGELITO BARROZO PEREZ, YAN KAR WENG, LIN YI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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