DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES

A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity in which the substrate can be positioned for molding, wherein the molding cavity has a first section covering a molding portion on a first side of the substrate and a second secti...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KUAH TENG HOCK, ANGELITO BARROZO PEREZ, YAN KAR WENG, LIN YI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity in which the substrate can be positioned for molding, wherein the molding cavity has a first section covering a molding portion on a first side of the substrate and a second section covering a molding portion on a second side of the substrate. Plungers for compressing a molding compound are disposed in first and second ports. First and second runners connect the first and second ports to the first and second sections of the molding cavity to introduce the molding compound on both sides of the substrate. In particular, the runners extend along both sides of the substrate from at least the edge of the substrate to the molding cavity. 기판의 제 1 측 및 제 2 측에 장착된 전자 부품을 몰딩하기 위한 몰딩 시스템은 몰딩을 위해 기판이 위치할 수 있는 몰딩 공동을 갖는다. 몰딩 공동은 기판의 제 1 측의 몰딩 부분을 덮는 제 1 섹션 및 기판의 제 2 측의 몰딩 부분을 덮는 제 2 섹션을 갖는다. 제 1 및 제 2 포트에는 몰딩 화합물을 압축하기 위한 플런저가 배치되어 있다. 제 1 및 제 2 러너는 기판의 양측에 몰딩 화합물을 도입하기 위해 제 1 및 제 2 포트를 몰딩 공동의 제 1 및 제 2 섹션에 연결한다. 특히, 러너는 기판의 양 측을 따라 적어도 기판의 에지로부터 몰딩 공동까지 연장된다.