Pressure sensitive adhesive

The present application can provide an adhesive suitable for flexible devices and a device containing the same. In one example, the present application can provide an adhesive which is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause defects be...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIN JIN SEO, PARK BYUNG SU, LEE HUI JE, KIM BYEONG HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ADVERTISING CHEMISTRY CRYPTOGRAPHY DISPLAY DISPLAYING DYES EDUCATION LABELS OR NAME-PLATES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES SEALS SIGNS USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	The present application can provide an adhesive suitable for flexible devices and a device containing the same. In one example, the present application can provide an adhesive which is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause defects before or after deformation, and has excellent recovery properties. 본 출원에서는 플렉서블 디바이스에 적합한 점착제 및 그를 포함하는 디바이스를 제공할 수 있다. 하나의 예시에서 본 출원에서는 플렉서블 디바이스에 적용되어 반복되는 변형과 회복에 효과적으로 대응하고, 변형 전후에 불량을 유발하지 않으며, 회복성도 우수한 점착제을 제공할 수 있다.