PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME
Provided are a photosensitive resin composition containing (A) a resin; (B) a photopolymerizable compound; (C) a photopolymerizable initiator; (D) a compound represented by the chemical formula 1; and (E) a solvent, a photosensitive resin film manufactured using the same, and a semiconductor device...
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| creator | BAE SHINHYO KIM JIYU KIM MINGYUM KO JINTAE BAEK TAEK JIN KANG HEEKYOUNG KIM SANG SOO LIM SANGHAK LEE DONGHWAN HONG CHUNGBEUM PARK INKEOL |
| description | Provided are a photosensitive resin composition containing (A) a resin; (B) a photopolymerizable compound; (C) a photopolymerizable initiator; (D) a compound represented by the chemical formula 1; and (E) a solvent, a photosensitive resin film manufactured using the same, and a semiconductor device including the photosensitive resin film. In the chemical formula 1, each substituent is as defined in the specification.
(A) 수지; (B) 광중합성 화합물; (C) 광중합 개시제; (D) 하기 화학식 1로 표시되는 화합물; 및 (E) 용매를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자가 제공된다. [화학식 1] JPEGpat00162.jpg5988 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.) |
| format | Patent |
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(A) 수지; (B) 광중합성 화합물; (C) 광중합 개시제; (D) 하기 화학식 1로 표시되는 화합물; 및 (E) 용매를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자가 제공된다. [화학식 1] JPEGpat00162.jpg5988 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230711&DB=EPODOC&CC=KR&NR=20230105565A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230711&DB=EPODOC&CC=KR&NR=20230105565A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAE SHINHYO</creatorcontrib><creatorcontrib>KIM JIYU</creatorcontrib><creatorcontrib>KIM MINGYUM</creatorcontrib><creatorcontrib>KO JINTAE</creatorcontrib><creatorcontrib>BAEK TAEK JIN</creatorcontrib><creatorcontrib>KANG HEEKYOUNG</creatorcontrib><creatorcontrib>KIM SANG SOO</creatorcontrib><creatorcontrib>LIM SANGHAK</creatorcontrib><creatorcontrib>LEE DONGHWAN</creatorcontrib><creatorcontrib>HONG CHUNGBEUM</creatorcontrib><creatorcontrib>PARK INKEOL</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME</title><description>Provided are a photosensitive resin composition containing (A) a resin; (B) a photopolymerizable compound; (C) a photopolymerizable initiator; (D) a compound represented by the chemical formula 1; and (E) a solvent, a photosensitive resin film manufactured using the same, and a semiconductor device including the photosensitive resin film. In the chemical formula 1, each substituent is as defined in the specification.
(A) 수지; (B) 광중합성 화합물; (C) 광중합 개시제; (D) 하기 화학식 1로 표시되는 화합물; 및 (E) 용매를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자가 제공된다. [화학식 1] JPEGpat00162.jpg5988 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAUQNEsDlL9hwfOQmyJe0ieJmjySpIWOpVS0km0UP8fFRwdnC5czpqNtaFEEX20ybYIAaP1oMjV9Dnk4Se4yg4DSK8horOKvG5UogAaW6sQmrc5QzIIUTrcsNU03Ja8_bZguxMmZfZ5fvR5mYcx3_Ozv4SSlxU_cCGOQlb_qRdrGDXK</recordid><startdate>20230711</startdate><enddate>20230711</enddate><creator>BAE SHINHYO</creator><creator>KIM JIYU</creator><creator>KIM MINGYUM</creator><creator>KO JINTAE</creator><creator>BAEK TAEK JIN</creator><creator>KANG HEEKYOUNG</creator><creator>KIM SANG SOO</creator><creator>LIM SANGHAK</creator><creator>LEE DONGHWAN</creator><creator>HONG CHUNGBEUM</creator><creator>PARK INKEOL</creator><scope>EVB</scope></search><sort><creationdate>20230711</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME</title><author>BAE SHINHYO ; KIM JIYU ; KIM MINGYUM ; KO JINTAE ; BAEK TAEK JIN ; KANG HEEKYOUNG ; KIM SANG SOO ; LIM SANGHAK ; LEE DONGHWAN ; HONG CHUNGBEUM ; PARK INKEOL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230105565A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>BAE SHINHYO</creatorcontrib><creatorcontrib>KIM JIYU</creatorcontrib><creatorcontrib>KIM MINGYUM</creatorcontrib><creatorcontrib>KO JINTAE</creatorcontrib><creatorcontrib>BAEK TAEK JIN</creatorcontrib><creatorcontrib>KANG HEEKYOUNG</creatorcontrib><creatorcontrib>KIM SANG SOO</creatorcontrib><creatorcontrib>LIM SANGHAK</creatorcontrib><creatorcontrib>LEE DONGHWAN</creatorcontrib><creatorcontrib>HONG CHUNGBEUM</creatorcontrib><creatorcontrib>PARK INKEOL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BAE SHINHYO</au><au>KIM JIYU</au><au>KIM MINGYUM</au><au>KO JINTAE</au><au>BAEK TAEK JIN</au><au>KANG HEEKYOUNG</au><au>KIM SANG SOO</au><au>LIM SANGHAK</au><au>LEE DONGHWAN</au><au>HONG CHUNGBEUM</au><au>PARK INKEOL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME</title><date>2023-07-11</date><risdate>2023</risdate><abstract>Provided are a photosensitive resin composition containing (A) a resin; (B) a photopolymerizable compound; (C) a photopolymerizable initiator; (D) a compound represented by the chemical formula 1; and (E) a solvent, a photosensitive resin film manufactured using the same, and a semiconductor device including the photosensitive resin film. In the chemical formula 1, each substituent is as defined in the specification.
(A) 수지; (B) 광중합성 화합물; (C) 광중합 개시제; (D) 하기 화학식 1로 표시되는 화합물; 및 (E) 용매를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자가 제공된다. [화학식 1] JPEGpat00162.jpg5988 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME |
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