PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME

Provided are a photosensitive resin composition containing (A) a resin; (B) a photopolymerizable compound; (C) a photopolymerizable initiator; (D) a compound represented by the chemical formula 1; and (E) a solvent, a photosensitive resin film manufactured using the same, and a semiconductor device...

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Bibliographische Detailangaben
Hauptverfasser:	BAE SHINHYO, KIM JIYU, KIM MINGYUM, KO JINTAE, BAEK TAEK JIN, KANG HEEKYOUNG, KIM SANG SOO, LIM SANGHAK, LEE DONGHWAN, HONG CHUNGBEUM, PARK INKEOL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided are a photosensitive resin composition containing (A) a resin; (B) a photopolymerizable compound; (C) a photopolymerizable initiator; (D) a compound represented by the chemical formula 1; and (E) a solvent, a photosensitive resin film manufactured using the same, and a semiconductor device including the photosensitive resin film. In the chemical formula 1, each substituent is as defined in the specification. (A) 수지; (B) 광중합성 화합물; (C) 광중합 개시제; (D) 하기 화학식 1로 표시되는 화합물; 및 (E) 용매를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자가 제공된다. [화학식 1] JPEGpat00162.jpg5988 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)