SUBSTRATE CLEANING APPARATUS OF DIE BONDING EQUIPMENT

An embodiment of the present invention provides a substrate cleaning device for die bonding equipment which can effectively remove foreign substances. According to the present invention, the provided substrate cleaning device for die bonding equipment includes: a body member located at the top of th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG YONG JUN, SONG CHI HUN, PARK JOON SEOUN, JUNG BYOUNG HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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