Substrate treating system and method thereof

Provided are a substrate processing system for performing a cleaning process for an unprocessed substrate as a target and a method thereof. The substrate processing method comprises the following steps of: cleaning a substrate by using a first fluid; cleaning the substrate by using a second fluid; a...

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Bibliographische Detailangaben
Hauptverfasser:	LEE BOK KYU, JEON MYUNG A, SIM BYUNG WOO, CHOI YOUNG SEOP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are a substrate processing system for performing a cleaning process for an unprocessed substrate as a target and a method thereof. The substrate processing method comprises the following steps of: cleaning a substrate by using a first fluid; cleaning the substrate by using a second fluid; and cleaning the substrate by using a third fluid. The first fluid, the second fluid and the third fluid include different components. The substrate is an unprocessed substrate. 미처리 기판을 대상으로 세정 공정을 수행하는 기판 처리 시스템 및 방법을 제공한다. 상기 기판 처리 방법은, 제1 유체를 이용하여 기판을 세정하는 단계; 제2 유체를 이용하여 기판을 세정하는 단계; 및 제3 유체를 이용하여 기판을 세정하는 단계를 포함하며, 제1 유체, 제2 유체 및 제3 유체는 서로 다른 성분을 포함하고, 기판은 미 처리된 기판이다.