APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR DETECTING BUBBLE

The present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate includes: a liquid supply unit that supplies liquid to the substrate, and a bubble detection unit that is installed on a component provided in the liquid supply unit and detects bubbles c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHOI KYU SEONG, SON SANG HYUN, PARK HYUNG MIN, LEE JUNG JIN, JUNG WOO SIN, CHO A RAH, GOH JUNG SUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate includes: a liquid supply unit that supplies liquid to the substrate, and a bubble detection unit that is installed on a component provided in the liquid supply unit and detects bubbles contained in the liquid flowing inside the component. The bubble detection part may include an ultrasonic oscillating member that oscillates ultrasonic waves from the outside of the component toward the component and an ultrasonic receiving member that receives the ultrasonic waves that have passed through the component. Therefore, it is possible to efficiently process the substrate. 본 발명은 기판을 처리하는 장치를 제공한다. 기판을 처리하는 장치는 기판에 액을 공급하는 액 공급 유닛 및 상기 액 공급 유닛에 제공된 부품에 설치되고, 상기 부품의 내부를 유동하는 상기 액에 포함되는 버블을 감지하는 버블 감지 유닛을 포함하되, 상기 버블 감지 유닛은 상기 부품의 외측에서 상기 부품을 향해 초음파를 발진시키는 초음파 발진 부재 및 상기 부품을 통과한 상기 초음파를 수신하는 초음파 수신 부재를 포함할 수 있다.