Hygroscopic adhesive composition

The present invention relates to a hygroscopic adhesive composition comprising: 50 to 75 parts by weight of an aqueous polymer binder; 25 to 50 parts by weight of a moisture-absorbing inorganic material; 1 to 10 parts by weight of a hydrophilic cross-linking monomer; and 1 to 5 parts by weight of an...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BAE KYUNG YUL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!