Hygroscopic adhesive composition
The present invention relates to a hygroscopic adhesive composition comprising: 50 to 75 parts by weight of an aqueous polymer binder; 25 to 50 parts by weight of a moisture-absorbing inorganic material; 1 to 10 parts by weight of a hydrophilic cross-linking monomer; and 1 to 5 parts by weight of an...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a hygroscopic adhesive composition comprising: 50 to 75 parts by weight of an aqueous polymer binder; 25 to 50 parts by weight of a moisture-absorbing inorganic material; 1 to 10 parts by weight of a hydrophilic cross-linking monomer; and 1 to 5 parts by weight of an initiator and, more specifically, to a hygroscopic adhesive composition which is not standardized to enable a film processing and has few spatial restrictions to have adhesion.
본 발명은 흡습성 접착제 조성물에 관한 것으로서, 필름 가공이 가능하도록 정형화되어 있지 않고, 부착력을 갖기에 공간적 제약이 적은 흡습성 접착제 조성물에 관한 것이다. |
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