ADHESIVE RESIN MIXTURE SELF-ASSEMBLY ANISOTROPIC CONDUCTIVE ADHESIVE WITH CONTROLLED FLUIDITY

One embodiment of the present invention provides an adhesive resin mixture with controlled fluidity, and a self-assembling anisotropic conductive adhesive containing the adhesive resin mixture. The self-assembling anisotropic conductive adhesive containing the adhesive resin mixture with controlled...

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Bibliographische Detailangaben
Hauptverfasser: PARK EUN HYE, LEE KYUNG SUB, JEONG SO UN
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:One embodiment of the present invention provides an adhesive resin mixture with controlled fluidity, and a self-assembling anisotropic conductive adhesive containing the adhesive resin mixture. The self-assembling anisotropic conductive adhesive containing the adhesive resin mixture with controlled fluidity provides superior adhesive strength and excellent contact resistance compared to conventional adhesives. 본 발명의 일실시예는 유동성이 조절된 접착수지혼합물과, 상기 접착수지혼합물을 포함하는 자가조립형 이방성 도전접착제를 제공한다. 상기 유동성이 조절된 접착수지혼합물을 포함하는 자가조립형 이방성 도전접착제는, 종래 제공되는 접착제보다 우수한 접착력을 제공하면서도 우수한 접촉저항을 제공한다.