MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

The present disclosure relates to a method for manufacturing a printed circuit board, which comprises the steps of: preparing a substrate including an insulating layer and a plurality of bump pads formed on one surface of the insulating layer; forming, on one surface of the insulating layer, first a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI. DAE CHUL, KIM HYE WON, JI SOO YOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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