MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

The present disclosure relates to a method for manufacturing a printed circuit board, which comprises the steps of: preparing a substrate including an insulating layer and a plurality of bump pads formed on one surface of the insulating layer; forming, on one surface of the insulating layer, first a...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI. DAE CHUL, KIM HYE WON, JI SOO YOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a method for manufacturing a printed circuit board, which comprises the steps of: preparing a substrate including an insulating layer and a plurality of bump pads formed on one surface of the insulating layer; forming, on one surface of the insulating layer, first and second solder resist layers to cover a plurality of bump pads; forming, in the first and second solder resist layers, a plurality of openings to expose at least a portion of each of the plurality of bump pads; forming a bump in each of the plurality of openings; and removing the second solder resist layer. 본 개시는 절연층, 및 절연층의 일면에 형성된 복수의 범프패드를 포함하는 기판을 준비하는 단계, 절연층의 일면에 복수의 범프패드를 커버하는 제1 및 제2 솔더레지스트층을 형성하는 단계, 제1 및 제2 솔더레지스트층에 복수의 범프패드 각각의 적어도 일부를 노출시키는 복수의 개구를 형성하는 단계, 복수의 개구에 각각 범프를 형성하는 단계, 제2솔더레지스트층을 제거하는 단계를 포함하는 인쇄회로기판의 제조방법에 관한 것이다.