APPARATUS AND METHOD FOR TREATING SUBSTRATE

An embodiment of the present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a support unit for supporting and rotating a substrate; a liquid supply unit for supplying a processing liquid to the substrate supported on the support unit; a heating unit...

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Bibliographische Detailangaben
Hauptverfasser:	KANG SHIN HWA, RYU SANG HYEON, PARK YOUNG HO, OH SEUNG UN, KIM KWANG SUP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACHINE TOOLS MATERIALS THEREFOR METAL-WORKING NOT OTHERWISE PROVIDED FOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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