EQUIPMENT FOR TREATING SUBSTRATE AND TREATMENT SOLUTION DEGASSING METHOD

The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a nozzle that supplies a chemical solution to a substrate; and a chemical solution supply device that supplies the chemical solution to the nozzle; The chemical solution supply device may in...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM HAE KYUNG, KIM DAE SUNG, JUNG WOO SIN, CHO A RAH
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a nozzle that supplies a chemical solution to a substrate; and a chemical solution supply device that supplies the chemical solution to the nozzle; The chemical solution supply device may include: a pump member; a dissolved gas extraction nozzle that is provided in a path through which the chemical solution flows into the pump member and ejects the chemical solution in a spray manner; and a control part that controls the operation of the pump member. Therefore, it is possible to easily maintain the substrate processing apparatus. 본 발명은 기판 처리 장치를 제공한다. 기판 처리 장치는 기판으로 약액을 공급하는 노즐; 상기 노즐로 약액을 공급하는 약액 공급 장치를 포함하되; 상기 약액 공급 장치는 펌프 부재; 상기 펌프 부재로 약액이 유입되는 경로에 제공되어 약액을 스프레이식으로 분출하는 용존가스 추출 노즐; 및 상기 펌프 부재의 동작을 제어하는 제어부를 포함할 수 있다.