SELECTIVE SOLDERING MACHINE

A selective soldering machine used to solder elements of a printed circuit board is disclosed. According to the present invention, provided is a selective soldering machine in which soldering is performed by contacting a molten solder ball to a substrate. The selective soldering machine comprises: a...

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Bibliographische Detailangaben
Hauptverfasser:	YOO SE JIN, JEONG SEUNG JOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CLEANING CLEANING IN GENERAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A selective soldering machine used to solder elements of a printed circuit board is disclosed. According to the present invention, provided is a selective soldering machine in which soldering is performed by contacting a molten solder ball to a substrate. The selective soldering machine comprises: a flux application unit for applying flux to the substrate; a preheating unit which preheats the substrate to which the flux is applied; and a solder unit which has a solder nozzle for generating solder balls and solders elements placed on the substrate. The present invention has effects such as selective control of preheating temperature, implementation of various soldering postures, and removal of residual foreign substances in the solder nozzle. 인쇄회로기판의 소자들을 솔더링하기 위해 사용되는 셀렉티브 솔더링 머신이 개시된다. 본 발명에 따르면, 기판에 용융된 솔더볼을 접촉시켜 솔더링을 수행하는 것으로, 기판에 플럭스를 도포하는 플럭스도포부; 플럭스가 도포된 기판을 예열하는 예열부; 및 솔더볼이 생성되는 솔더노즐을 구비하고, 기판에 배치된 소자를 솔더링하는 솔더부;를 포함하는 셀렉티브 솔더링 머신이 제공된다. 본 발명은 예열 온도의 선별적 제어, 다양한 솔더링 자세의 구현, 솔더노즐의 잔여 이물질 제거 등의 효과를 가진다.