Polishing pad containing uniformly distriputed liquid pores and method for manufacturing the same

The present invention provides a polishing pad and a manufacturing method thereof, comprising a polishing layer that includes: a polymer matrix; liquid microelements dispersed and embedded within the polymer matrix; and pores defined by the liquid microelements and opened to the surface of a polishi...

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Bibliographische Detailangaben
Hauptverfasser:	KIM SANG MAN, MIN BYUNG JU, SONG KEE CHEON, HONG SEOK JI, KIM SEUNG GEUN, OH NAM GUE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a polishing pad and a manufacturing method thereof, comprising a polishing layer that includes: a polymer matrix; liquid microelements dispersed and embedded within the polymer matrix; and pores defined by the liquid microelements and opened to the surface of a polishing surface by separation of the liquid microelements, wherein the liquid microelements contain a compound containing a hydrophobic group and a hydrophilic group, thereby capable of providing excellent polishing uniformity and polishing speed. 본 발명은 폴리머 매트릭스; 상기 폴리머 매트릭스 내에 분산하여 임베드된 액상 미소요소; 및 상기 액상 미소요소들에 의해 정의되고 상기 액상 미소요소들의 이탈에 의해 연마면 표면으로 개방된 기공;을 포함하는 연마층을 포함하며, 상기 액상 미소요소들은 소수성 그룹과 친수성 그룹을 포함하는 화합물을 포함하는 것을 특징으로 하는 연마 패드 및 이의 제조방법을 제공한다.