heating plate and substrate processing equipment having the same
The present invention relates to a substrate processing device, and more specifically to a flat heater which heats a substrate for substrate processing and a substrate processing device having the same. According to the present invention, the flat heater is disclosed which is a flat heater (200) inc...
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Zusammenfassung: | The present invention relates to a substrate processing device, and more specifically to a flat heater which heats a substrate for substrate processing and a substrate processing device having the same. According to the present invention, the flat heater is disclosed which is a flat heater (200) including a plurality of heating elements (212, 222, 232) disposed in each of a plurality of heating areas (210, 220, 230) capable of independent temperature control. The heating elements (212, 222, 232) disposed in at least one of the plurality of heating areas (210, 220, 230) have different installation heights in a thickness direction from heating elements (212, 222, 232) of heating areas (210, 220, 230) adjacent to the corresponding heating area (210, 220, 230). Accordingly, stable substrate processing can be performed.
본 발명은 기판처리장치에 관한 것으로서, 보다 상세하게는 기판처리를 위하여 기판을 가열하는 평판히터 및 그를 가지는 기판처리장치에 관한 것이다. 본 발명은, 각각 독립된 온도제어가 가능한 복수의 히팅영역들(210, 220, 230) 각각에 배치되는 복수의 발열체(212, 222, 232)들을 포함하는 평판히터(200)로서, 상기 복수의 히팅영역들(210, 220, 230)들 중 적어도 하나에 배치된 상기 발열체(212, 222, 232)는, 해당 히팅영역(210, 220, 230)에 인접하는 히팅영역(210, 220, 230)의 발열체(212, 222, 232)와 두께방향으로의 설치높이가 상이하게 위치된 것을 특징으로 하는 평판히터를 개시한다. |
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