METHOD FOR RECYCLING OF PARTS FOR SEMICONDUCTOR MANUFACTURING AND RECYCLED PARTS

The present invention relates to a method for recycling parts for manufacturing a semiconductor and recycled parts. The recycling method according to an embodiment of the present invention comprises: a graphite substrate preparation step of preparing a graphite substrate; a damaged part mounting ste...

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Bibliographische Detailangaben
Hauptverfasser:	KO MYUNG JIN, LEE SUNG HO, CHO HYEON JUN, OH SE DU, KOO BUN HEI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA METALLURGY REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	The present invention relates to a method for recycling parts for manufacturing a semiconductor and recycled parts. The recycling method according to an embodiment of the present invention comprises: a graphite substrate preparation step of preparing a graphite substrate; a damaged part mounting step of positioning a damaged surface of a semiconductor manufacturing part damaged by plasma to come in contact with the graphite substrate; a reproduction unit forming step of forming a reproduction unit on the damaged semiconductor manufacturing part; and a processing step of processing the part on which the reproduction unit is formed, into a desired shape. 본 발명은 반도체 제조용 부품의 재생방법 및 재생부품에 관한 것으로 본 발명의 일 실시예에 따른 재생방법은 흑연 기재를 준비하는 흑연 기재 준비 단계, 플라즈마에 의해 손상된 반도체 제조용 부품의 손상면이 상기 흑연 기재에 맞닿도록 위치시키는 손상 부품 장착 단계, 상기 손상된 반도체 제조용 부품상에 재생부를 형성하는 재생부 형성 단계, 및 재생부가 형성된 부품을 원하는 형상으로 가공하는 가공 단계를 포함한다.