PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

The present disclosure relates to a printed circuit board comprising an insulating layer, a plurality of pads disposed on the insulating layer, and a plurality of insulating walls disposed on the insulating layer and covering each of the plurality of pads but not disposed on an upper surface of each...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM SANG HOON, HWANG CHI WON, HONG SUK CHANG, KIM HEA SUNG, KIM GYU MOOK, KO YOUNG KUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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