PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

The present disclosure relates to a printed circuit board comprising an insulating layer, a plurality of pads disposed on the insulating layer, and a plurality of insulating walls disposed on the insulating layer and covering each of the plurality of pads but not disposed on an upper surface of each...

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Bibliographische Detailangaben
Hauptverfasser:	KIM SANG HOON, HWANG CHI WON, HONG SUK CHANG, KIM HEA SUNG, KIM GYU MOOK, KO YOUNG KUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a printed circuit board comprising an insulating layer, a plurality of pads disposed on the insulating layer, and a plurality of insulating walls disposed on the insulating layer and covering each of the plurality of pads but not disposed on an upper surface of each of the plurality of pads, wherein the plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer; and a manufacturing method thereof. Therefore, the present invention is capable of providing the printed circuit board that is easy to manufacture. 본 개시는 절연층, 절연층 상에 배치되는 복수의 패드, 및 절연층 상에 배치되며 복수의 패드 각각을 커버하되 복수의 패드 각각의 상면 상에는 배치되지 않는 복수의 절연벽을 포함하며, 복수의 절연벽이 절연층 상에서 서로 이격되어 배치되는 인쇄회로기판과, 그 제조방법에 관한 것이다.