FLEXIBLE PRINTED CIRCUIT BOARD COMPRISING BONDING LAYER OF POLYMER AND METHOD FOR PREPARING THE SAME
The present invention relates to a flexible printed circuit board comprising a polymer adhesive layer and a manufacturing method thereof. The flexible printed circuit board, which is one aspect of the present invention, comprises the polymer adhesive layer, and can minimize a detachment phenomenon b...
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| creator | LIM CHAE MIN YEOM CHI SEON KANG MOON SIG |
| description | The present invention relates to a flexible printed circuit board comprising a polymer adhesive layer and a manufacturing method thereof. The flexible printed circuit board, which is one aspect of the present invention, comprises the polymer adhesive layer, and can minimize a detachment phenomenon between a wiring and an electrode printed on a board.
본 발명은 고분자 접착층을 포함한 유연인쇄회로기판과 그 제조방법에 관한 것이다. 본 발명의 일 측면인 유연인쇄회로기판은 고분자 접착층을 포함하여, 기판 상에 인쇄된 배선 및 전극과 기판간의 탈리 현상을 최소화할 수 있다. |
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본 발명은 고분자 접착층을 포함한 유연인쇄회로기판과 그 제조방법에 관한 것이다. 본 발명의 일 측면인 유연인쇄회로기판은 고분자 접착층을 포함하여, 기판 상에 인쇄된 배선 및 전극과 기판간의 탈리 현상을 최소화할 수 있다.</description><language>eng ; kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230601&DB=EPODOC&CC=KR&NR=20230077210A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230601&DB=EPODOC&CC=KR&NR=20230077210A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIM CHAE MIN</creatorcontrib><creatorcontrib>YEOM CHI SEON</creatorcontrib><creatorcontrib>KANG MOON SIG</creatorcontrib><title>FLEXIBLE PRINTED CIRCUIT BOARD COMPRISING BONDING LAYER OF POLYMER AND METHOD FOR PREPARING THE SAME</title><description>The present invention relates to a flexible printed circuit board comprising a polymer adhesive layer and a manufacturing method thereof. The flexible printed circuit board, which is one aspect of the present invention, comprises the polymer adhesive layer, and can minimize a detachment phenomenon between a wiring and an electrode printed on a board.
본 발명은 고분자 접착층을 포함한 유연인쇄회로기판과 그 제조방법에 관한 것이다. 본 발명의 일 측면인 유연인쇄회로기판은 고분자 접착층을 포함하여, 기판 상에 인쇄된 배선 및 전극과 기판간의 탈리 현상을 최소화할 수 있다.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsKwjAUhrM4iPoOB5yFmA6d0-bEBnMppxHsVIrGSbRQ3x9T8AGc_tvHv2Z3bfFqKovQkvERFdSG6ouJUAVJOQWXh874Uy68WtTKHgmChjbY3mUrvQKHsQkKdKB8hK2khYwNQicdbtnqMT7ntPvphu01xro5pOk9pHkab-mVPsOZBBcF52UpjlwW_1FfBko1Ew</recordid><startdate>20230601</startdate><enddate>20230601</enddate><creator>LIM CHAE MIN</creator><creator>YEOM CHI SEON</creator><creator>KANG MOON SIG</creator><scope>EVB</scope></search><sort><creationdate>20230601</creationdate><title>FLEXIBLE PRINTED CIRCUIT BOARD COMPRISING BONDING LAYER OF POLYMER AND METHOD FOR PREPARING THE SAME</title><author>LIM CHAE MIN ; YEOM CHI SEON ; KANG MOON SIG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230077210A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIM CHAE MIN</creatorcontrib><creatorcontrib>YEOM CHI SEON</creatorcontrib><creatorcontrib>KANG MOON SIG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIM CHAE MIN</au><au>YEOM CHI SEON</au><au>KANG MOON SIG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLEXIBLE PRINTED CIRCUIT BOARD COMPRISING BONDING LAYER OF POLYMER AND METHOD FOR PREPARING THE SAME</title><date>2023-06-01</date><risdate>2023</risdate><abstract>The present invention relates to a flexible printed circuit board comprising a polymer adhesive layer and a manufacturing method thereof. The flexible printed circuit board, which is one aspect of the present invention, comprises the polymer adhesive layer, and can minimize a detachment phenomenon between a wiring and an electrode printed on a board.
본 발명은 고분자 접착층을 포함한 유연인쇄회로기판과 그 제조방법에 관한 것이다. 본 발명의 일 측면인 유연인쇄회로기판은 고분자 접착층을 포함하여, 기판 상에 인쇄된 배선 및 전극과 기판간의 탈리 현상을 최소화할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
| title | FLEXIBLE PRINTED CIRCUIT BOARD COMPRISING BONDING LAYER OF POLYMER AND METHOD FOR PREPARING THE SAME |
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