FLEXIBLE PRINTED CIRCUIT BOARD COMPRISING BONDING LAYER OF POLYMER AND METHOD FOR PREPARING THE SAME

The present invention relates to a flexible printed circuit board comprising a polymer adhesive layer and a manufacturing method thereof. The flexible printed circuit board, which is one aspect of the present invention, comprises the polymer adhesive layer, and can minimize a detachment phenomenon b...

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Bibliographische Detailangaben
Hauptverfasser:	LIM CHAE MIN, YEOM CHI SEON, KANG MOON SIG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a flexible printed circuit board comprising a polymer adhesive layer and a manufacturing method thereof. The flexible printed circuit board, which is one aspect of the present invention, comprises the polymer adhesive layer, and can minimize a detachment phenomenon between a wiring and an electrode printed on a board. 본 발명은 고분자 접착층을 포함한 유연인쇄회로기판과 그 제조방법에 관한 것이다. 본 발명의 일 측면인 유연인쇄회로기판은 고분자 접착층을 포함하여, 기판 상에 인쇄된 배선 및 전극과 기판간의 탈리 현상을 최소화할 수 있다.