Composite plating heat dissipation sheet and manufacturing method thereof using tip sonic

Proposed are a composite plating heat dissipation sheet having excellence in electromagnetic wave shielding performance and heat dissipation characteristics and a manufacturing method thereof using a tip sonic. The method for manufacturing the composite plating heat dissipation sheet according to th...

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Bibliographische Detailangaben
Hauptverfasser:	YOO MYONG JAE, SUH MOON SUHK, JEON YEONG MU, YANG WOO SEOK, LEE CHURL SEUNG, CHOI WON JUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	Proposed are a composite plating heat dissipation sheet having excellence in electromagnetic wave shielding performance and heat dissipation characteristics and a manufacturing method thereof using a tip sonic. The method for manufacturing the composite plating heat dissipation sheet according to the present invention comprises: a step of inserting an electromagnetic wave reflecting material, an electromagnetic wave absorbing material, and an electrolyte into a plating bath; a step of mounting a heat dissipation sheet in the plating bath; and a step of electroplating the electromagnetic wave reflecting material and electromagnetic wave absorbing material on the heat dissipation sheet to form an electromagnetic wave shielding layer on the heat dissipation sheet. 전자파차폐성능 및 방열특성이 우수한 복합도금방열시트 및 팁소닉을 이용한 그의 제조방법이 제안된다. 본 발명에 따른 복합도금방열시트 제조방법은 전자파 반사소재, 전자파 흡수소재 및 전해액을 도금조에 투입하는 단계; 도금조에 방열시트를 장착하는 단계; 및 전자파 반사소재 및 전자파 흡수소재를 방열시트에 전기도금하여 방열시트 상에 전자파차폐층을 형성하는 단계;를 포함한다.