PROCESSING METHOD FOR BONDING OF MICRO COAXIAL CABLE

Disclosed is a processing method for bonding of a micro coaxial cable. The processing method includes the steps of: stripping some areas of a jacket of a micro coaxial cable; trimming a metal shielding film of the micro coaxial cable exposed as a part of the jacket is stripped by irradiating a laser...

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Bibliographische Detailangaben
Hauptverfasser:	HWANG CHANG SOON, HYUN BYOUNG ROK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Disclosed is a processing method for bonding of a micro coaxial cable. The processing method includes the steps of: stripping some areas of a jacket of a micro coaxial cable; trimming a metal shielding film of the micro coaxial cable exposed as a part of the jacket is stripped by irradiating a laser; stripping a first region of the exposed metal shielding film based on a cut line generated by trimming; soldering a ground bar on upper and lower surfaces of an unstripped second area of the exposed metal shielding film; and stripping a portion of an insulating film of the micro coaxial cable exposed as the first region of the metal shielding film is stripped. The present invention provides an optimal shielding strip and joining solution to prevent thermal damage to the insulation film of the micro coaxial cable. 극세 동축 케이블의 접합을 위한 처리 방법이 개시된다. 본 처리 방법은, 극세 동축 케이블의 자켓의 일부 영역을 스트립하는 단계, 자켓의 일부 영역이 스트립됨에 따라 노출된 극세 동축 케이블의 금속 차폐막에 레이저를 조사하여 트리밍하는 단계, 트리밍에 따라 생성된 절단선을 기반으로, 노출된 금속 차폐막의 제1 영역을 스트립하는 단계, 노출된 금속 차폐막 중 스트립되지 않은 제2 영역의 상하면에 그라운드바를 솔더링하는 단계, 금속 차폐막의 제1 영역이 스트립됨에 따라 노출된 극세 동축 케이블의 절연막의 일부 영역을 스트립하는 단계를 포함한다.