반도체용 접착제, 및, 반도체 장치 및 그 제조 방법

열가소성 수지, 열경화성 수지, 경화제 및 유기산을 포함하는 반도체용 접착제로서, 유기산은, 산성 관능기를 2개 이상 갖는, 산해리 상수 pKa가 4.0 이하의 화합물인, 반도체용 접착제. An adhesive agent for semiconductors, which comprises a thermoplastic resin, a heat-curable resin, a curing agent and an organic acid, in which the organic acid is a compound having at least two...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAHARA MASANOBU, NAKADA TAKAHIRO, KAWAMATA RYUTA, MASUNO DAISUKE, IWABUCHI RYUNOSUKE, CHABANA KOICHI
Format:	Patent
Sprache:	kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	열가소성 수지, 열경화성 수지, 경화제 및 유기산을 포함하는 반도체용 접착제로서, 유기산은, 산성 관능기를 2개 이상 갖는, 산해리 상수 pKa가 4.0 이하의 화합물인, 반도체용 접착제. An adhesive agent for semiconductors, which comprises a thermoplastic resin, a heat-curable resin, a curing agent and an organic acid, in which the organic acid is a compound having at least two acidic functional groups and having an acid dissociation constant pKa of 4.0 or less.