PRINTED CIRCUIT BOARD

The present disclosure relates to a printed circuit board comprising: a first insulating material; and a second insulating material disposed on one surface of the first insulating material and comprising first and second cavities having different depths, wherein at least one groove part is formed on...

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Bibliographische Detailangaben
Hauptverfasser:	LIM GUH HWAN, LEE WON SEOK, LEE JIN UK, KIM CHI SEONG, PARK JIN OH
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a printed circuit board comprising: a first insulating material; and a second insulating material disposed on one surface of the first insulating material and comprising first and second cavities having different depths, wherein at least one groove part is formed on each side surface of the first and second cavities. Therefore, the present invention is capable of providing the printed circuit board comprising a fine circuit and/or a fine via. 본 개시는, 제1 절연재; 및 상기 제1 절연재 일면에 배치되며, 서로 다른 깊이를 가지는 제1 및 제2 캐비티를 포함하는 제2 절연재;를 포함하고, 상기 제1 및 제2 캐비티 각각의 측면에는 적어도 하나의 홈부가 형성된, 인쇄회로기판 에 관한 것이다.