SUBSTRATE PROCESSING APPARATUS

According to the present invention, a substrate processing device includes: a wiper facing a nozzle surface of an ink-jet head unit; a cleaning pad unit provided opposite to or in contact with the wiper on the opposite side of the ink-jet head unit, having a through hole formed corresponding to a di...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOU JAE HYUN, LIM HUN SUB
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	According to the present invention, a substrate processing device includes: a wiper facing a nozzle surface of an ink-jet head unit; a cleaning pad unit provided opposite to or in contact with the wiper on the opposite side of the ink-jet head unit, having a through hole formed corresponding to a discharge port of the ink-jet head unit, and a hollow space formed therein; and a suction unit which communicates with the through hole of the cleaning pad and suctions the inside of the discharge port through the cleaning pad unit. Therefore, the quality of a product can be improved by removing solidified ink inside the discharge port. 본 발명의 기판 처리 장치는, 잉크젯 헤드 유닛의 노즐면에 대향되는 와이퍼; 상기 잉크젯 헤드 유닛의 반대편에서 상기 와이퍼와 대향되거나 맞닿게 마련되며, 상기 잉크젯 헤드 유닛의 토출구에 대응하여 관통공이 형성되고, 내부에 중공이 형성되는 세정 패드부; 및 상기 세정 패드부의 관통공과 연통되어 상기 세정 패드부를 통해 상기 토출구의 내부를 석셕하는 흡입부를 포함한다.