ULTRA-WIDEBAND CHIP INTERCONNECT STRUCTURE TO PROVIDE THE GROUND

Disclosed is an ultra-wideband chip interconnect structure providing the ground. The ultra-wideband chip interconnect structure providing the ground comprises: a first chip which has at least one first signal line and at least one first ground formed thereon; a second chip which has at least one sec...

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Bibliographische Detailangaben

Hauptverfasser:	JANG YEONG MIN, JEONG JIN HO, JEON YOUNG CHAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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