GRANULE TYPE RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE

The present invention relates to a granule type resin composition for encapsulating a semiconductor device, and a semiconductor device encapsulated using the same. The present invention provides the granule type resin composition for encapsulating the semiconductor device having excellent filling pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KONG BYUNG SEON, SHIM MYOUNG TAEK, KIM DAE JIN, KIM SEUNG TAEK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a granule type resin composition for encapsulating a semiconductor device, and a semiconductor device encapsulated using the same. The present invention provides the granule type resin composition for encapsulating the semiconductor device having excellent filling properties suitable for the molding volume of a semiconductor package by adjusting the correlation between a molding volume of a semiconductor package and the particle size of the resin composition for encapsulating the granular semiconductor device. 본 발명은 과립형 반도체 소자 봉지용 수지 조성물 및 이를 이용하여 봉지된 반도체 소자에 관한 것이다.