PHOTOSENSITIVE RESIN COMPOSITION AND PHOTORESIST FILM FORMED FROM THE SAME AND METHOD OF FORMING PATTERN USING THE SAME

Embodiments of the present invention provide a positive-type photosensitive resin composition including a resin component, a photoacid generator, and a solvent. It is possible to form a resist film with improved dissolution resistance and developability against immersion liquid through the structura...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI HYUNG SUB, CHO BAEK HYUN, KWUN GI JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Embodiments of the present invention provide a positive-type photosensitive resin composition including a resin component, a photoacid generator, and a solvent. It is possible to form a resist film with improved dissolution resistance and developability against immersion liquid through the structural units included in the resin component. The present invention relates to a positive-type photosensitive resin composition comprising: a resin component comprising a first structural unit represented by chemical formula 1, and a second structural unit containing an acid-soluble group; a mineral generator; and a solvent. 본 발명의 실시예들은 수지 성분, 광산 발생제 및 용제를 포함하는 포지티브형 감광성 수지 조성물을 제공한다. 수지 성분에 포함된 구조 단위들을 통해 액침액에 대한 내용출성 및 현상성이 향상된 레지스트 막을 형성할 수 있다.