Metal particle for adhesive paste preparing method thereof solder paste including the same composite bonding structure formed thereof and semiconductor device including the composite bonding structure

Provided are a metal particle for adhesive paste, a manufacturing method thereof, a composite bonded structure formed therefrom, and a semiconductor device including the same. The metal particle for adhesive paste includes: a core containing one or more metals; and a shell disposed on at least one s...

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Bibliographische Detailangaben
Hauptverfasser:	CHU, KUN MO, LEE, JUNG HOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided are a metal particle for adhesive paste, a manufacturing method thereof, a composite bonded structure formed therefrom, and a semiconductor device including the same. The metal particle for adhesive paste includes: a core containing one or more metals; and a shell disposed on at least one surface of the core and including one or more metals and nanoparticles. The metal particle is a transient liquid phase particle, and the melting point of the metal of the core is higher than the melting point of the metal of the shell. 1종 이상의 금속을 포함하는 코어; 및 상기 코어의 적어도 일면상에 배치되며, 1종 이상의 금속과 나노입자를 포함하는 쉘;을 함유하는 금속 입자를 포함하며, 상기 금속 입자는 천이 액상(Transient liquid phase) 입자이며, 상기 코어의 금속의 융점이 상기 쉘의 금속의 융점보다 높은 접착 페이스트용 금속 입자, 그 제조방법, 이로부터 형성된 복합 접합구조체 및 이를 포함한 반도체 소자를 제공한다.