ELECTRONIC DEVICE INCLUDING HEAT RADIATION STRUCTURE
The present invention relates to an electronic device including a heat radiation structure, which comprises: a bracket which includes a first area, a second area partitioned from the first area, and a heat radiation area formed from a portion of the first area to a portion of the second area; a circ...
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| creator | KWON MOONHYUNG HAM TAEWOOK YUN YOUNGGIRL HEO WONHYUNG CHOI TAEKKYUN |
| description | The present invention relates to an electronic device including a heat radiation structure, which comprises: a bracket which includes a first area, a second area partitioned from the first area, and a heat radiation area formed from a portion of the first area to a portion of the second area; a circuit board which includes a heat source and is arranged in the first area; a battery which arranged in the second area; a vapor chamber which is provided in the heat dissipation area, and includes a first part facing the heat source to provide a heat transfer path from the heat source, and a second part facing the battery; and a filling member which is applied between the second area and the battery to transfer heat radiated from the vapor chamber to the battery. The vapor chamber may include a buffer area formed in an edge area thereof to accommodate the filling member. Therefore, the electronic device can effectively disperse heat generated from the heat source.
본 개시는 방열 구조를 포함하는 전자 장치에 관한 것으로서, 전자 장치는 제1 영역, 상기 제1 영역과 구획된 제2 영역 및 상기 제1 영역의 일부로부터 상기 제2 영역의 일부까지 형성된 방열 영역을 포함하는 브라켓; 발열원을 포함하고 상기 제1 영역에 배치된 회로기판; 상기 제2 영역에 배치된 배터리; 상기 방열 영역에 배치되고, 상기 발열원으로부터 발생한 열의 전달 경로를 제공하기 위해 상기 발열원과 대면 배치되는 제1 부분 및 상기 배터리와 대면 배치되는 제2 부분을 포함하는 베이퍼 챔버; 및 상기 베이퍼 챔버에서 방사된 열을 상기 배터리로 전달하기 위하여 상기 제2 영역과 상기 배터리 사이에 도포된 충진 부재를 포함하고, 상기 베이퍼 챔버는, 상기 충진 부재를 수용하기 위하여 가장자리 영역에 형성된 버퍼 영역을 포함할 수 있다. |
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본 개시는 방열 구조를 포함하는 전자 장치에 관한 것으로서, 전자 장치는 제1 영역, 상기 제1 영역과 구획된 제2 영역 및 상기 제1 영역의 일부로부터 상기 제2 영역의 일부까지 형성된 방열 영역을 포함하는 브라켓; 발열원을 포함하고 상기 제1 영역에 배치된 회로기판; 상기 제2 영역에 배치된 배터리; 상기 방열 영역에 배치되고, 상기 발열원으로부터 발생한 열의 전달 경로를 제공하기 위해 상기 발열원과 대면 배치되는 제1 부분 및 상기 배터리와 대면 배치되는 제2 부분을 포함하는 베이퍼 챔버; 및 상기 베이퍼 챔버에서 방사된 열을 상기 배터리로 전달하기 위하여 상기 제2 영역과 상기 배터리 사이에 도포된 충진 부재를 포함하고, 상기 베이퍼 챔버는, 상기 충진 부재를 수용하기 위하여 가장자리 영역에 형성된 버퍼 영역을 포함할 수 있다.</description><language>eng ; kor</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230404&DB=EPODOC&CC=KR&NR=20230045444A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230404&DB=EPODOC&CC=KR&NR=20230045444A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KWON MOONHYUNG</creatorcontrib><creatorcontrib>HAM TAEWOOK</creatorcontrib><creatorcontrib>YUN YOUNGGIRL</creatorcontrib><creatorcontrib>HEO WONHYUNG</creatorcontrib><creatorcontrib>CHOI TAEKKYUN</creatorcontrib><title>ELECTRONIC DEVICE INCLUDING HEAT RADIATION STRUCTURE</title><description>The present invention relates to an electronic device including a heat radiation structure, which comprises: a bracket which includes a first area, a second area partitioned from the first area, and a heat radiation area formed from a portion of the first area to a portion of the second area; a circuit board which includes a heat source and is arranged in the first area; a battery which arranged in the second area; a vapor chamber which is provided in the heat dissipation area, and includes a first part facing the heat source to provide a heat transfer path from the heat source, and a second part facing the battery; and a filling member which is applied between the second area and the battery to transfer heat radiated from the vapor chamber to the battery. The vapor chamber may include a buffer area formed in an edge area thereof to accommodate the filling member. Therefore, the electronic device can effectively disperse heat generated from the heat source.
본 개시는 방열 구조를 포함하는 전자 장치에 관한 것으로서, 전자 장치는 제1 영역, 상기 제1 영역과 구획된 제2 영역 및 상기 제1 영역의 일부로부터 상기 제2 영역의 일부까지 형성된 방열 영역을 포함하는 브라켓; 발열원을 포함하고 상기 제1 영역에 배치된 회로기판; 상기 제2 영역에 배치된 배터리; 상기 방열 영역에 배치되고, 상기 발열원으로부터 발생한 열의 전달 경로를 제공하기 위해 상기 발열원과 대면 배치되는 제1 부분 및 상기 배터리와 대면 배치되는 제2 부분을 포함하는 베이퍼 챔버; 및 상기 베이퍼 챔버에서 방사된 열을 상기 배터리로 전달하기 위하여 상기 제2 영역과 상기 배터리 사이에 도포된 충진 부재를 포함하고, 상기 베이퍼 챔버는, 상기 충진 부재를 수용하기 위하여 가장자리 영역에 형성된 버퍼 영역을 포함할 수 있다.</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBx9XF1Dgny9_N0VnBxDfN0dlXw9HP2CXXx9HNX8HB1DFEIcnTxdAzx9PdTCA4JCnUOCQ1y5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGxgYGJqYmJiaOxsSpAgBrXyhS</recordid><startdate>20230404</startdate><enddate>20230404</enddate><creator>KWON MOONHYUNG</creator><creator>HAM TAEWOOK</creator><creator>YUN YOUNGGIRL</creator><creator>HEO WONHYUNG</creator><creator>CHOI TAEKKYUN</creator><scope>EVB</scope></search><sort><creationdate>20230404</creationdate><title>ELECTRONIC DEVICE INCLUDING HEAT RADIATION STRUCTURE</title><author>KWON MOONHYUNG ; HAM TAEWOOK ; YUN YOUNGGIRL ; HEO WONHYUNG ; CHOI TAEKKYUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230045444A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>KWON MOONHYUNG</creatorcontrib><creatorcontrib>HAM TAEWOOK</creatorcontrib><creatorcontrib>YUN YOUNGGIRL</creatorcontrib><creatorcontrib>HEO WONHYUNG</creatorcontrib><creatorcontrib>CHOI TAEKKYUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KWON MOONHYUNG</au><au>HAM TAEWOOK</au><au>YUN YOUNGGIRL</au><au>HEO WONHYUNG</au><au>CHOI TAEKKYUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE INCLUDING HEAT RADIATION STRUCTURE</title><date>2023-04-04</date><risdate>2023</risdate><abstract>The present invention relates to an electronic device including a heat radiation structure, which comprises: a bracket which includes a first area, a second area partitioned from the first area, and a heat radiation area formed from a portion of the first area to a portion of the second area; a circuit board which includes a heat source and is arranged in the first area; a battery which arranged in the second area; a vapor chamber which is provided in the heat dissipation area, and includes a first part facing the heat source to provide a heat transfer path from the heat source, and a second part facing the battery; and a filling member which is applied between the second area and the battery to transfer heat radiated from the vapor chamber to the battery. The vapor chamber may include a buffer area formed in an edge area thereof to accommodate the filling member. Therefore, the electronic device can effectively disperse heat generated from the heat source.
본 개시는 방열 구조를 포함하는 전자 장치에 관한 것으로서, 전자 장치는 제1 영역, 상기 제1 영역과 구획된 제2 영역 및 상기 제1 영역의 일부로부터 상기 제2 영역의 일부까지 형성된 방열 영역을 포함하는 브라켓; 발열원을 포함하고 상기 제1 영역에 배치된 회로기판; 상기 제2 영역에 배치된 배터리; 상기 방열 영역에 배치되고, 상기 발열원으로부터 발생한 열의 전달 경로를 제공하기 위해 상기 발열원과 대면 배치되는 제1 부분 및 상기 배터리와 대면 배치되는 제2 부분을 포함하는 베이퍼 챔버; 및 상기 베이퍼 챔버에서 방사된 열을 상기 배터리로 전달하기 위하여 상기 제2 영역과 상기 배터리 사이에 도포된 충진 부재를 포함하고, 상기 베이퍼 챔버는, 상기 충진 부재를 수용하기 위하여 가장자리 영역에 형성된 버퍼 영역을 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
| title | ELECTRONIC DEVICE INCLUDING HEAT RADIATION STRUCTURE |
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