SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The present invention provides a technique for recovering gas contained in exhaust gas from a processing chamber. A substrate processing apparatus comprises a processing chamber for processing a substrate, and a filter unit including a porous coordination polymer provided in an exhaust path for exha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOMORI EIICHI, OKABE TSUNEYUKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention provides a technique for recovering gas contained in exhaust gas from a processing chamber. A substrate processing apparatus comprises a processing chamber for processing a substrate, and a filter unit including a porous coordination polymer provided in an exhaust path for exhausting gas from the processing chamber. 본 발명은, 처리 챔버로부터의 배기 가스에 포함되는 가스를 회수하는 기술을 제공한다. 기판의 처리를 행하는 처리 챔버와, 상기 처리 챔버로부터 가스를 배기하는 배기 경로에 마련되는 다공성 배위 고분자를 포함하는 여과부를 구비하는 기판 처리 장치.