도금 피막 및 도금 피막의 제조 방법

본 발명은 유리 기판에 대해 양호한 밀착성을 발휘하는 도금 피막을 제공한다. 본 발명은 산화물층, 무전해 도금 피막 및 전해 구리 도금 피막을 이 순서로 갖는 것을 특징으로 하는 도금 피막이다. The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TSUKUDA MAYU, FUKU SHUHEI, NAGAO TOSHIMITSU, SHIMADA KAZUYA, HAYAMIZU MASAHITO, SAKATA TOSHIHIKO, HIROOKA ASUKA, KATAYAMA JUNICHI
Format:	Patent
Sprache:	kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	본 발명은 유리 기판에 대해 양호한 밀착성을 발휘하는 도금 피막을 제공한다. 본 발명은 산화물층, 무전해 도금 피막 및 전해 구리 도금 피막을 이 순서로 갖는 것을 특징으로 하는 도금 피막이다. The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.