SEMICONDUCTOR PACKAGE

A semiconductor package according to an embodiment of the present invention may include: a circuit board including a wiring structure; first and second semiconductor chips disposed on the circuit board and connected to the wiring structure; a dummy chip disposed on the circuit board and disposed bet...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE YOUNG MIN, KIM DONG KWAN, KO JI HAN, RYU JUNG SEOK, CHANG WON GI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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