Semiconductor package substrate and method for manufacturing the same Semiconductor package
A semiconductor package substrate, a manufacturing method thereof, and a semiconductor package are provided. According to one embodiment of the present invention, a semiconductor package substrate is provided that includes: a base substrate of a conductive material having a first trench on a lower s...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | A semiconductor package substrate, a manufacturing method thereof, and a semiconductor package are provided. According to one embodiment of the present invention, a semiconductor package substrate is provided that includes: a base substrate of a conductive material having a first trench on a lower surface, a second trench and a third trench on an upper surface and forming a circuit pattern; a first resin disposed in the first trench; and a second resin disposed in the second trench and the third trench. The second trench exposes at least a portion of the first resin. Therefore, it is possible to provide a semiconductor package substrate with simple process and excellent reliability.
반도체 패키지 기판, 그의 제조방법, 및 반도체 패키지를 제공한다. 본 발명의 일 실시예는, 하면에 제1트렌치를 구비하고, 상면에 제2트렌치 및 제3트렌치를 구비하며 회로 패턴을 이루는 전도성 소재의 베이스 기판; 상기 제1트렌치에 배치된 제1수지; 및 상기 제2트렌치 및 제3트렌치에 배치된 제2수지;를 포함하며, 상기 제2트렌치는 상기 제1수지를 적어도 일부 노출하는, 반도체 패키지 기판을 제공한다. |
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