SEMICONDUCTOR PACKAGE AND SUBSTRATE FOR SEMICONDUCTOR PACKAGE

A semiconductor package is provided. The semiconductor package includes: a connection structure having a connection terminal disposed thereon; and a semiconductor chip disposed on the connection structure and connected to the connection structure. The connection structure includes a plurality of wir...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KWON JIN MO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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