Method For Treating Solar Panel Silicon For Recycling And Apparatus For The Same

The present invention relates to a method for pulverizing waste silicon wafers and simultaneously removing EVA from waste silicon wafers by low-temperature pyrolyzing and grinding of waste silicon wafers dismantled from waste solar panels or waste silicon wafers generated in a manufacturing process....

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	CHOI, JUN CHEOL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CRUSHING, PULVERISING, OR DISINTEGRATING CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL DISPOSAL OF SOLID WASTE MAKING GRANULES OR PREFORMS MILLING GRAIN PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PREPARATORY TREATMENT OF GRAIN FOR MILLING RECLAMATION OF CONTAMINED SOIL SOIL RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a method for pulverizing waste silicon wafers and simultaneously removing EVA from waste silicon wafers by low-temperature pyrolyzing and grinding of waste silicon wafers dismantled from waste solar panels or waste silicon wafers generated in a manufacturing process. The method includes: a preparation step of preparing waste silicon wafers; a cutting step of cutting the waste silicon wafers prepared in the preparation step; a crushing step of crushing the cut waste silicon wafers; a low-temperature pyrolyzing/grinding step of removing EVA by low-temperature pyrolyzing/grinding the waste solar silicon crushed in the crushing step. 본 발명은 폐태양광 패널에서 해체한 폐실리콘웨이퍼 또는 제조공정에서 발생한 폐실리콘웨이퍼를 저온열분해 및 분쇄에 의해 폐실리콘웨이퍼로부터 폐실리콘웨이퍼를 미분화와 동시에 EVA를 제거하는 방법에 관한 것이다. 그 구성은, 폐실리콘웨이퍼의 준비단계와; 상기 준비단계에서 준비된 폐실리콘웨이퍼를 절단하는 단계와; 상기 절단된 폐실리콘웨이퍼를 파쇄하는 파쇄단계와; 상기 파쇄단계에서 파쇄된 폐태양광 실리콘을 저온열분해/분쇄시켜 EVA를 제거하는 저온열분해/분쇄단계; 를 포함하여 구성된 것을 특징으로 한다.