Semiconductor package

According to embodiments of the present invention, a semiconductor package includes: a substrate; a first semiconductor chip disposed on the substrate and having a first sidewall and a second sidewall different from the first sidewall; a second semiconductor chip disposed on the substrate and spaced...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YU HAE JUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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