SEPARATING METHOD SEPARATING APPARATUS AND SEPARATING SYSTEM

SEPARATING METHOD SEPARATING APPARATUS AND SEPARATING SYSTEM

A technique for increasing the efficiency of a separating treatment is provided. A separating method according to one aspect of the present disclosure includes a holding process and a separating process. In the holding process, a polymerized substrate to which a first substrate and a second substrat...

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Bibliographische Detailangaben
Hauptverfasser: TERADA TAKASHI, KITAYAMA TATSUYA, NODA KAZUTAKA, FUKUTOMI AKIRA, SAKAMOTO RYOICHI, MIMURA YUJI, MAEDA HIROSHI, HONDA MASARU, YAMASAKI YUTAKA
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A technique for increasing the efficiency of a separating treatment is provided. A separating method according to one aspect of the present disclosure includes a holding process and a separating process. In the holding process, a polymerized substrate to which a first substrate and a second substrate are bonded is held. In the separating process, the first substrate is separated from the polymerized substrate starting from the side surface of the polymerized substrate. Moreover, a separating process includes a process of allowing fluid containing water to be contact with respect to a side surface. 박리 처리를 효율화할 수 있는 기술을 제공한다. 본 개시의 일태양에 따른 박리 방법은, 유지하는 공정과, 박리하는 공정을 포함한다. 유지하는 공정은, 제 1 기판과 제 2 기판이 접합된 중합 기판을 유지한다. 박리하는 공정은, 중합 기판의 측면을 기점으로 하여 중합 기판으로부터 제 1 기판을 박리한다. 또한, 박리하는 공정은, 측면에 대하여 물을 포함하는 유체를 접촉시키는 공정을 포함한다.