METHOD AND ELECTRONIC DEVICE FOR IDENTIFYING DEFECTS IN SEMICONDUCTOR WAFERS

The present invention relates to a method and electronic device for identifying a defect in a semiconductor wafer. The method includes: receiving, by the electronic device, a plurality of semiconductor wafer images of different sizes and/or quality; determining, by the electronic device, one operati...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHASHISHEKARA PARAMPALLI ADIGA, PRASHANT PANDURANG SHINDE, PRIYADARSHINI PANEMANGALORE PAI
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to a method and electronic device for identifying a defect in a semiconductor wafer. The method includes: receiving, by the electronic device, a plurality of semiconductor wafer images of different sizes and/or quality; determining, by the electronic device, one operation mode among a plurality of operation modes to process one semiconductor wafer image among the plurality of semiconductor wafer images; and identifying, by the electronic device, a defect in a semiconductor wafer of the semiconductor wafer image based on the determined operating mode. 본 발명은 반도체 웨이퍼의 결함을 식별하는 방법 및 전자 장치에 관한 것으로, 전자 장치에 의해, 크기 및/또는 품질이 상이한 복수의 반도체 웨이퍼 이미지들을 수신하고, 전자 장치에 의해, 상기 복수의 반도체 웨이퍼 이미지들 중 하나의 반도체 웨이퍼 이미지를 처리하기 위하여 복수의 동작 모드들 중에서 하나의 동작 모드(operation mode)를 결정하고, 전자 장치에 의해, 상기 결정된 동작 모드(operating mode)에 기초하여 상기 반도체 웨이퍼 이미지의 반도체 웨이퍼의 결함(defect)을 식별한다.