RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION

The present invention relates to: a resist underlayer film composition containing a polymer having a structural unit represented by chemical formula 1, a structural unit represented by chemical formula 2, or a combination thereof, and a solvent; and a pattern-forming method using the resist underlay...

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Hauptverfasser: KWON SOONHYUNG, CHUN MINKI, KIM SEONGJIN, BAEK JAEYEOL, KIM MINSOO, PARK HYEON, JIN HWAYOUNG, NAMGUNG RAN, CHOI YOOJEONG, SONG DAESEOK
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creator KWON SOONHYUNG
CHUN MINKI
KIM SEONGJIN
BAEK JAEYEOL
KIM MINSOO
PARK HYEON
JIN HWAYOUNG
NAMGUNG RAN
CHOI YOOJEONG
SONG DAESEOK
description The present invention relates to: a resist underlayer film composition containing a polymer having a structural unit represented by chemical formula 1, a structural unit represented by chemical formula 2, or a combination thereof, and a solvent; and a pattern-forming method using the resist underlayer film composition. The definitions of the formula 1 and formula 2 are as described in the specification. The pattern collapse of a resist can be prevented. 하기 화학식 1로 표시되는 구조단위, 하기 화학식 2로 표시되는 구조단위, 또는 이들의 조합을 포함하는 중합체, 및 용매를 포함하는 레지스트 하층막용 조성물; 그리고 상기 레지스트 하층막용 조성물을 이용하는 패턴형성방법에 관한 것이다. [화학식 1] JPEGpat00033.jpg41109 [화학식 2] JPEGpat00034.jpg63112 상기 화학식 1 및 화학식 2의 정의는 명세서 내에 기재한 바와 같다.
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The definitions of the formula 1 and formula 2 are as described in the specification. The pattern collapse of a resist can be prevented. 하기 화학식 1로 표시되는 구조단위, 하기 화학식 2로 표시되는 구조단위, 또는 이들의 조합을 포함하는 중합체, 및 용매를 포함하는 레지스트 하층막용 조성물; 그리고 상기 레지스트 하층막용 조성물을 이용하는 패턴형성방법에 관한 것이다. 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The definitions of the formula 1 and formula 2 are as described in the specification. The pattern collapse of a resist can be prevented. 하기 화학식 1로 표시되는 구조단위, 하기 화학식 2로 표시되는 구조단위, 또는 이들의 조합을 포함하는 중합체, 및 용매를 포함하는 레지스트 하층막용 조성물; 그리고 상기 레지스트 하층막용 조성물을 이용하는 패턴형성방법에 관한 것이다. [화학식 1] JPEGpat00033.jpg41109 [화학식 2] JPEGpat00034.jpg63112 상기 화학식 1 및 화학식 2의 정의는 명세서 내에 기재한 바와 같다.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgKcg32DA5RCPVzcQ3ycYx0DVJw9vcN8A_2DPH091Nw9HNR8HUN8fB3UfB3U3DzD_L19HNXCHAMCXEN8gtWCA0GcUM8XJE18TCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwMjYwMDI1MjU0tHY-JUAQDKLTDh</recordid><startdate>20230221</startdate><enddate>20230221</enddate><creator>KWON SOONHYUNG</creator><creator>CHUN MINKI</creator><creator>KIM SEONGJIN</creator><creator>BAEK JAEYEOL</creator><creator>KIM MINSOO</creator><creator>PARK HYEON</creator><creator>JIN HWAYOUNG</creator><creator>NAMGUNG RAN</creator><creator>CHOI YOOJEONG</creator><creator>SONG DAESEOK</creator><scope>EVB</scope></search><sort><creationdate>20230221</creationdate><title>RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</title><author>KWON SOONHYUNG ; CHUN MINKI ; KIM SEONGJIN ; BAEK JAEYEOL ; KIM MINSOO ; PARK HYEON ; JIN HWAYOUNG ; NAMGUNG RAN ; CHOI YOOJEONG ; SONG DAESEOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230025259A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KWON SOONHYUNG</creatorcontrib><creatorcontrib>CHUN MINKI</creatorcontrib><creatorcontrib>KIM SEONGJIN</creatorcontrib><creatorcontrib>BAEK JAEYEOL</creatorcontrib><creatorcontrib>KIM MINSOO</creatorcontrib><creatorcontrib>PARK HYEON</creatorcontrib><creatorcontrib>JIN HWAYOUNG</creatorcontrib><creatorcontrib>NAMGUNG RAN</creatorcontrib><creatorcontrib>CHOI YOOJEONG</creatorcontrib><creatorcontrib>SONG DAESEOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KWON SOONHYUNG</au><au>CHUN MINKI</au><au>KIM SEONGJIN</au><au>BAEK JAEYEOL</au><au>KIM MINSOO</au><au>PARK HYEON</au><au>JIN HWAYOUNG</au><au>NAMGUNG RAN</au><au>CHOI YOOJEONG</au><au>SONG DAESEOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</title><date>2023-02-21</date><risdate>2023</risdate><abstract>The present invention relates to: a resist underlayer film composition containing a polymer having a structural unit represented by chemical formula 1, a structural unit represented by chemical formula 2, or a combination thereof, and a solvent; and a pattern-forming method using the resist underlayer film composition. The definitions of the formula 1 and formula 2 are as described in the specification. The pattern collapse of a resist can be prevented. 하기 화학식 1로 표시되는 구조단위, 하기 화학식 2로 표시되는 구조단위, 또는 이들의 조합을 포함하는 중합체, 및 용매를 포함하는 레지스트 하층막용 조성물; 그리고 상기 레지스트 하층막용 조성물을 이용하는 패턴형성방법에 관한 것이다. [화학식 1] JPEGpat00033.jpg41109 [화학식 2] JPEGpat00034.jpg63112 상기 화학식 1 및 화학식 2의 정의는 명세서 내에 기재한 바와 같다.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
title RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
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