TREATING LIQUID SPRAY APPARATUS

Disclosed is a treatment liquid spray apparatus. The treatment liquid spray apparatus of the present invention includes: a swing head part swingably installed about a first axis; a tilting arm part connected to the swing head to be tilted and rotated around a second axis; a treatment liquid supply p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BAEK SEUNG DAE, KIM SUNG YUP
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:Disclosed is a treatment liquid spray apparatus. The treatment liquid spray apparatus of the present invention includes: a swing head part swingably installed about a first axis; a tilting arm part connected to the swing head to be tilted and rotated around a second axis; a treatment liquid supply part installed in the swing head part and the tilting arm part; a spray nozzle part connected to the treatment liquid supply part and installed in the swing head part to spray the treatment liquid supplied from the treatment liquid supply part; and a tilting driving part connected to the tilting arm part to tilt and rotate the tilting arm part. Therefore, it is possible to improve the removal efficiency of foreign substances in a wafer part 처리액 분사장치에 대한 발명이 개시된다. 본 발명의 처리액 분사장치는: 제1축을 중심으로 스윙 가능하게 설치되는 스윙 헤드부; 제2축을 중심으로 틸팅 회전되도록 스윙 헤드부에 연결되는 틸팅암부; 스윙 헤드부와 틸팅암부에 설치되는 처리액 공급부; 처리액 공급부에 연결되고, 처리액 공급부에서 공급되는 처리액을 분사하도록 스윙 헤드부에 설치되는 분사노즐부; 및 틸팅암부를 틸팅 회전시키도록 틸팅암부에 연결되는 틸팅 구동부를 포함하는 것을 특징으로 한다.