A MICROSPEAKER MODULE HAVING A VENT HOLE USED FOR FILLLING HOLE AND A DUCT COMMUNICATING WITH THE VENT HOLE

The present invention relates to a microspeaker module equipped with a pipe conduit communicating with a back volume vent hole. A structure of the present invention provides the microspeaker module equipped with the pipe conduit communicating with a surrounding vent hole of a vent hole formed in a c...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG SUNG CHUL, HA JONG HEON, HA JEONG AE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	The present invention relates to a microspeaker module equipped with a pipe conduit communicating with a back volume vent hole. A structure of the present invention provides the microspeaker module equipped with the pipe conduit communicating with a surrounding vent hole of a vent hole formed in a case defining the back volume, and allowing outside air to flow in/out of the back volume through the pipe conduit. Therefore, the present invention is capable of having an advantage of being able to prevent an increase in internal pressure. 본 발명은 백 볼륨 벤트 홀과 연통하는 관로를 구비하는 마이크로스피커 모듈에 관한 것이다. 본 발명의 구조는 백 볼륨을 정의하는 케이스에 형성되는 벤트 홀의 주위에 벤트홀과 연통하는 관로를 구비하며, 관로를 통해 백 볼륨으로 외부 공기가 유출입하는 마이크로스피커 모듈을 제공한다.