SEMICONDUCTOR PACKAGE

A semiconductor package according to the technical idea of the present invention includes a plurality of semiconductor chips, each of which includes a semiconductor substrate and a redistribution layer disposed on an active surface of the semiconductor substrate; a redistribution structure in which...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK JONG HO, FUJISAKI ATSUSHI, BAE SEONG HOON, KANG GYU HO, CHOI JU IL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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