PLATE ELECTRONIC DEVICE COMPRISING THE SAME AND METHOD OF MANUFACTURING THE PLATE

According to various embodiments, a plate may include: a first portion; a second portion disposed on one side of the first portion; and at least one processing unit formed on the first portion and the second portion. The processing unit penetrates the first portion and forms a groove in one part of...

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Bibliographische Detailangaben
Hauptverfasser:	JAESEON KIM, GIWON SEOL, YONGWOOK HWANG, JUNGHYEON HWANG, JINHO LEE, BYOUNGHEE CHOI, JEONGYEON JEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CALCULATING COMPUTING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING COUNTING ELECTRIC DIGITAL DATA PROCESSING FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR MILLING MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS REGULATING TRANSPORTING
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Beschreibung
Zusammenfassung:	According to various embodiments, a plate may include: a first portion; a second portion disposed on one side of the first portion; and at least one processing unit formed on the first portion and the second portion. The processing unit penetrates the first portion and forms a groove in one part of the second portion. The first portion is removed by a cutting process, and a first surface roughness of one surface of the second portion exposed by removing the first portion may be different from a second surface roughness of an inner surface of the groove formed on the second portion. In addition, various embodiments are possible. 다양한 실시 예에 따르면, 플레이트는, 제1 부분; 상기 제1 부분의 일측에 배치되는 제2 부분 및 상기 제1 부분 및 상기 제2 부분 상에 형성되는 적어도 하나의 가공부를 포함하고, 상기 가공부는 상기 제1 부분을 관통하고 상기 제2 부분의 일 부분에 홈을 형성하며, 상기 제1 부분은 절삭 공정에 의하여 제거되고, 상기 제1 부분의 제거에 의하여 노출되는 제2 부분의 일면의 제1 표면조도는 상기 제2 부분 상에 형성된 상기 홈의 내면의 제2 표면조도와 상이할 수 있다. 그 외에도 다양한 실시 예들이 가능하다.