CIRCUIT BOARD AND PACKAGE SUBSTRATE HAVING THE SAME

A circuit board according to an embodiment comprises: an insulation layer comprising an upper surface and a lower surface; and a penetration electrode having a first slope penetrating the upper surface and lower surface of the insulation layer and gradually decreasing in width toward the lower surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BAE JAE MAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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