CIRCUIT BOARD AND PACKAGE SUBSTRATE HAVING THE SAME

A circuit board according to an embodiment comprises: an insulation layer comprising an upper surface and a lower surface; and a penetration electrode having a first slope penetrating the upper surface and lower surface of the insulation layer and gradually decreasing in width toward the lower surfa...

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Bibliographische Detailangaben
1. Verfasser:	BAE JAE MAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A circuit board according to an embodiment comprises: an insulation layer comprising an upper surface and a lower surface; and a penetration electrode having a first slope penetrating the upper surface and lower surface of the insulation layer and gradually decreasing in width toward the lower surface of the insulation layer, wherein the penetration electrode comprises a void part having a slope different from the first slope. Therefore, the present invention is capable of simplifying a manufacturing process. 실시 예에 따른 회로 기판은 상면 및 하면을 포함하는 절연층; 및 상기 절연층의 상면 및 하면을 관통하며, 상기 절연층의 하면을 향할수록 폭이 점진적으로 감소하는 제1 경사를 갖는 관통 전극을 포함하고, 상기 관통 전극은, 상기 제1 경사와 다른 경사를 갖는 보이드부를 포함한다.